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beryllium copper mold

Product Name: Beryllium Copper Mold
Glue material: POM
Product unit weight: 3.2g
Shrinkage: 20‰
Injection molding machine: 60T
Injection system: cold runner submersible injection mold 
Number of holes: 1*2 Mold base standard: DME standard, template P20
PRODUCT PARAMETERSMOLD DISPLAYFORMING CYCLE SCHEMEPARTNERInquiry

PRODUCT PARAMETERS

product name beryllium copper mold Gum POM
Product unit weight 3.2g Shrinkage 20‰
Injection molding machine 60T injection system Cold runner diving glue feeding
Number of mold cavities 1*2 Mold base standard DME standard, template P20
Mold core material Imported beryllium copper C17200 material Mold size 200X200X246mm
Mold weight 85kg Mold structure slider
design time 1 week manufacturing time 4 weeks

MOLD DISPLAY


FORMING CYCLE SCHEME

PARTNER

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